SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

A semiconductor package is provided. The semiconductor package includes: a wiring structure including a first insulating layer and a first conductive pattern in the first insulating layer; a first semiconductor chip on the wiring structure; an interposer including a first sidewall including a second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK JONG HO, JIN JEONG GI, FUJISAKI ATSUSHI, BAE SEONG HOON, KANG GYU HO, CHOI JU IL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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