SEMICONDUCTOR DEVICE

One objective of the present invention enables a heat sink arranged on a semiconductor chip and a substrate to solve the problem that an adhesive part between the heat sink and the substrate is peeled by stress caused by thermal expansion or thermal contraction. A semiconductor device includes: a su...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HIROBE MASAO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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