Jig structure for semiconductor packaging process and manufacturing method thereof

Disclosed are a jig structure for a semiconductor packaging process and a manufacturing method thereof. The disclosed jig structure for a semiconductor packaging process can comprise: a jig-shaped metal body; a surface-modified layer formed on a surface unit of the metal body; an adhesive layer arra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DONG SU LEE, YOUNG KYU NO, JAE YONG CHOI, SUKKYUNG HONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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