SUBSTRATE PROCESSING APPARATUS HAVING CHAMBER COVER
A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber, and a loading chamber on a turn table. The dry polishing chamber includes: a polishing device on the turntable; and a chamber cover including a cover plate, a blocking filter dis...
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| creator | KIM JWA HYEON HA KYUNG HO JOO SUNG JOON CHO BONG SU |
| description | A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber, and a loading chamber on a turn table. The dry polishing chamber includes: a polishing device on the turntable; and a chamber cover including a cover plate, a blocking filter disposed at an intake port formed in the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the blocking filter and is disposed between the polishing device and the blocking filter.
기판 처리 장치는 턴 테이블 상의 제1 연마 챔버, 제2 연마 챔버, 건식 연마 챔버 및 로딩 챔버를 포함한다. 상기 건식 연마 챔버는 상기 턴 테이블 상의 연마 장치; 및 커버 플레이트, 상기 커버 플레이트에 형성된 흡기구에 배치된 차단 필터 및 상기 커버 플레이트와 연결된 파티클 배리어를 포함하는 챔버 커버를 포함한다. 상기 파티클 배리어는 상기 차단 필터와 대향하며, 상기 연마 장치와 상기 차단 필터 사이에 배치된다. |
| format | Patent |
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기판 처리 장치는 턴 테이블 상의 제1 연마 챔버, 제2 연마 챔버, 건식 연마 챔버 및 로딩 챔버를 포함한다. 상기 건식 연마 챔버는 상기 턴 테이블 상의 연마 장치; 및 커버 플레이트, 상기 커버 플레이트에 형성된 흡기구에 배치된 차단 필터 및 상기 커버 플레이트와 연결된 파티클 배리어를 포함하는 챔버 커버를 포함한다. 상기 파티클 배리어는 상기 차단 필터와 대향하며, 상기 연마 장치와 상기 차단 필터 사이에 배치된다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=KR&NR=20230012775A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=KR&NR=20230012775A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM JWA HYEON</creatorcontrib><creatorcontrib>HA KYUNG HO</creatorcontrib><creatorcontrib>JOO SUNG JOON</creatorcontrib><creatorcontrib>CHO BONG SU</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS HAVING CHAMBER COVER</title><description>A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber, and a loading chamber on a turn table. The dry polishing chamber includes: a polishing device on the turntable; and a chamber cover including a cover plate, a blocking filter disposed at an intake port formed in the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the blocking filter and is disposed between the polishing device and the blocking filter.
기판 처리 장치는 턴 테이블 상의 제1 연마 챔버, 제2 연마 챔버, 건식 연마 챔버 및 로딩 챔버를 포함한다. 상기 건식 연마 챔버는 상기 턴 테이블 상의 연마 장치; 및 커버 플레이트, 상기 커버 플레이트에 형성된 흡기구에 배치된 차단 필터 및 상기 커버 플레이트와 연결된 파티클 배리어를 포함하는 챔버 커버를 포함한다. 상기 파티클 배리어는 상기 차단 필터와 대향하며, 상기 연마 장치와 상기 차단 필터 사이에 배치된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAODnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBit4OIaBBJw9HH2dXIMUnP3DXIN4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgZGxgYGhkbm5qaMxcaoAWyYoKQ</recordid><startdate>20230126</startdate><enddate>20230126</enddate><creator>KIM JWA HYEON</creator><creator>HA KYUNG HO</creator><creator>JOO SUNG JOON</creator><creator>CHO BONG SU</creator><scope>EVB</scope></search><sort><creationdate>20230126</creationdate><title>SUBSTRATE PROCESSING APPARATUS HAVING CHAMBER COVER</title><author>KIM JWA HYEON ; HA KYUNG HO ; JOO SUNG JOON ; CHO BONG SU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230012775A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM JWA HYEON</creatorcontrib><creatorcontrib>HA KYUNG HO</creatorcontrib><creatorcontrib>JOO SUNG JOON</creatorcontrib><creatorcontrib>CHO BONG SU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM JWA HYEON</au><au>HA KYUNG HO</au><au>JOO SUNG JOON</au><au>CHO BONG SU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS HAVING CHAMBER COVER</title><date>2023-01-26</date><risdate>2023</risdate><abstract>A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber, and a loading chamber on a turn table. The dry polishing chamber includes: a polishing device on the turntable; and a chamber cover including a cover plate, a blocking filter disposed at an intake port formed in the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the blocking filter and is disposed between the polishing device and the blocking filter.
기판 처리 장치는 턴 테이블 상의 제1 연마 챔버, 제2 연마 챔버, 건식 연마 챔버 및 로딩 챔버를 포함한다. 상기 건식 연마 챔버는 상기 턴 테이블 상의 연마 장치; 및 커버 플레이트, 상기 커버 플레이트에 형성된 흡기구에 배치된 차단 필터 및 상기 커버 플레이트와 연결된 파티클 배리어를 포함하는 챔버 커버를 포함한다. 상기 파티클 배리어는 상기 차단 필터와 대향하며, 상기 연마 장치와 상기 차단 필터 사이에 배치된다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SUBSTRATE PROCESSING APPARATUS HAVING CHAMBER COVER |
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