LED MODULE

The present invention relates to an LED module. The LED module includes: a light emitting part; a substrate part electrically connected to the light emitting part; and a heat dissipation part disposed below the light emitting part and the substrate part. The heat dissipation part is to be subjected...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHAE KI HOON, HAN GIL WON, HONG JAE WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to an LED module. The LED module includes: a light emitting part; a substrate part electrically connected to the light emitting part; and a heat dissipation part disposed below the light emitting part and the substrate part. The heat dissipation part is to be subjected to surface treatment. The purpose of the present invention is to provide an LED module capable of increasing heat dissipation performance and reducing size and weight. 본 발명은 엘이디 모듈에 관한 것으로서, 엘이디 모듈은 발광부, 상기 발광부와 전기적으로 연결되는 기판부, 상기 발광부 및 상기 기판부의 하측에 배치되는 방열부를 포함하고, 상기 방열부는, 표면 처리가 적용될 수 있다.