Substrate disposition apparatus

One embodiment of a substrate processing device comprises: a first chamber; a second chamber, in which a substrate is disposed, disposed inside the first chamber; and a mounting unit where the substrate is mounted and the second chamber is disposed on an upper side. The second chamber comprises an u...

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Bibliographische Detailangaben
Hauptverfasser:	PARK KWANG SU, KOO BUN HEI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	One embodiment of a substrate processing device comprises: a first chamber; a second chamber, in which a substrate is disposed, disposed inside the first chamber; and a mounting unit where the substrate is mounted and the second chamber is disposed on an upper side. The second chamber comprises an upper plate provided to be rotatable and opening and closing the inside of the second chamber according to rotation. 기판 처리장치의 일 실시예는, 제1챔버; 상기 제1챔버 내부에 배치되고, 내부에 기판이 배치되는 제2챔버; 및 상기 기판이 안착하고, 상측에 상기 제2챔버가 배치되는 안착부를 포함하고, 상기 제2챔버는, 회전가능 하도록 구비되고, 회전함에 따라 상기 제2챔버 내부를 개폐하는 상부판을 포함할 수 있다.