SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD OF FORMING THE SAME

According to the present invention, a semiconductor device includes a first structure having a first dielectric layer and a first conductive pattern in the first dielectric layer, wherein the first conductive pattern includes a first conductive material and a first bond reinforcement material. In ad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOON KWANG JIN, KIM TAE SEONG, JEON HYUNG JUN, KIM TAE YEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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