LAMINATE AND METHOD FOR PRODUCING THE SAME

Provided are an insulating substrate having a thermoplastic resin as the outermost layer, a laminate having a smooth interface of a metal layer formed thereon and having excellent adhesion between an insulator and the metal layer and a method for manufacturing the same, and a printed wiring board ma...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAKAMI JUN, FURUTANI AKINORI, FUKAZAWA NORIMASA, FUJIKAWA WATARU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are an insulating substrate having a thermoplastic resin as the outermost layer, a laminate having a smooth interface of a metal layer formed thereon and having excellent adhesion between an insulator and the metal layer and a method for manufacturing the same, and a printed wiring board manufactured by using the laminate. Disclosed is a laminate excellent in adhesion, wherein the laminate is configured by sequentially stacking a thermoplastic resin layer (B), a primer layer (C), and a metal layer (D) on an insulating substrate (A). 열가소성 수지를 최표층에 가지는 절연성 기재와, 그 위에 형성된 금속층의 계면이 평활하고, 또한, 절연체-금속층 간의 밀착성이 우수한 적층체, 및 그 제조 방법, 그리고, 당해 적층체를 이용하여 제조되는 프린트 배선판을 제공한다. 절연성 기재 (A) 상에, 열가소성 수지층 (B), 프라이머층 (C), 및 금속층 (D)가 순차적으로 적층된 것을 특징으로 하는 적층체를 이용함으로써, 밀착성이 우수한 적층체를 발견한 것이다.