Transparent member electronic device including same and thermoforming method of transparent member

A method for molding a transparent member according to an embodiment of the present invention comprises the steps of: injecting a first transparent substrate and a second transparent substrate into a first cavity having a first depth of a lower mold and a second cavity connected to the first cavity...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SANGUNG AN, JONGCHEOL JANG, HOSOON LEE, HYUNSUK CHOI, JUREE KIM, JUNSEOK KIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL
Online-Zugang:	Volltext bestellen
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