POLISHING PAD INCLUDING A PLURALITY OF PATTERN STRUCTURES

The present application relates to a polishing pad including a plurality of pattern structures, wherein the polishing pad includes an upper pad and a lower pad, and the plurality of pattern structures are continuously formed on a surface of the upper pad. The polishing effect can be improved through...

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Bibliographische Detailangaben
Hauptverfasser:	SONG SUN WOONG, KIM SUB, KIM PAL KON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present application relates to a polishing pad including a plurality of pattern structures, wherein the polishing pad includes an upper pad and a lower pad, and the plurality of pattern structures are continuously formed on a surface of the upper pad. The polishing effect can be improved through the optimal combination of the size and spacing of the pattern structures with the optimal range. 본원은, 복수의 패턴 구조체를 포함하는 연마 패드에 관한 것이다.