ORGANIC FILM POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

The present invention relates to: an organic film polishing composition which includes a polishing accelerator containing both a hydrophilic group and a hydrophobic group, so that a polishing rate is maintained high not only for polymers, SOC, and SOH, but also for organic films that are strongly bo...

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Bibliographische Detailangaben
Hauptverfasser:	YOO JAE HONG, KIM HEE SUK, LEE GOO HWA, PARK JONG DAI, KIM JAE HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	The present invention relates to: an organic film polishing composition which includes a polishing accelerator containing both a hydrophilic group and a hydrophobic group, so that a polishing rate is maintained high not only for polymers, SOC, and SOH, but also for organic films that are strongly bonded by covalent bonds, such as amorphous carbon films (ACL) or diamond-like carbon (DLC); and a polishing method using the same. 본 발명은 친수성기와 소수성기를 모두 포함하고 있는 연마촉진제를 포함하여 폴리머(Polymer), SOC, SOH 뿐만 아니라, 무정형 탄소막(ACL) 또는 DLC(Diamond-Like Carbon)와 같이 공유결합으로 강하게 결합되어 있는 유기막에 대하여도 연마 속도가 높게 유지되는 유기막 연마 조성물 및 이를 이용한 연마 방법에 관한 것이다.