Thermoelectric element including metal intermediary layer and bonding method thereof

The present invention relates to a thermoelectric element including a metal medium layer. More specifically, the thermoelectric element includes: an element arrangement board made by placing electrodes on an upper side of a substrate; and a plurality of thermoelectric legs bonded to an upper part of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RYU BYUNG KI, PARK SU DONG, JANG JEONG IN, CHUNG JAY WAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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