A seal cap and a semiconductor manufacturing equipment comprising thereof

The present invention relates to a seal cap and semiconductor manufacturing equipment including the same. The seal cap includes: a body capable of lifting and blocking an opening hole; a heating part disposed inside the body; a first heat transfer part disposed on an upper surface of the heating par...

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Bibliographische Detailangaben
1. Verfasser:	LIM TAE HWA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a seal cap and semiconductor manufacturing equipment including the same. The seal cap includes: a body capable of lifting and blocking an opening hole; a heating part disposed inside the body; a first heat transfer part disposed on an upper surface of the heating part to transfer heat from the heating part to the inside of a reactor; and a support coupled to the body to support the heating part. The seal cap opens and closes the open hole of the reactor for applying heat to an introduced wafer. 본 발명은 실캡 및 이를 포함하는 반도체 생산 설비에 관한 것으로, 승강할 수 있고 상기 개방홀을 차단할 수 있는 몸체, 상기 몸체의 내부에 배치되어 있는 발열부, 상기 발열부의 상면에 배치되어 상기 발열부의 열을 상기 반응로의 내부로 전달할 수 있는 제1 열전달부 및 상기 몸체에 결합되어 상기 발열부를 지지하는 지지부를 포함하며, 상기 실캡은 투입된 웨이퍼에 열을 가하는 반응로의 개방홀을 개폐시킨다.