Pressure sensitive adhesive composition

This application provides an adhesive composition, which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects (eg, observation of deformation marks) before and after deformation, has excellent cutting and workability, does not cause lift...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RYU SEUNG YEON, LEE YEON KEUN, KIM JI YOUNG, KIM HYUN CHEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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