Pressure sensitive adhesive composition

This application provides an adhesive composition, which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects (eg, observation of deformation marks) before and after deformation, has excellent cutting and workability, does not cause lift...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	RYU SEUNG YEON, LEE YEON KEUN, KIM JI YOUNG, KIM HYUN CHEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This application provides an adhesive composition, which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects (eg, observation of deformation marks) before and after deformation, has excellent cutting and workability, does not cause lifting and peeling and/or air bubbles and exhibits a level of transmittance at which a polarizing plate can be omitted. 본 출원은, 플렉서블 디바이스에 적용되어 반복되는 변형과 회복에 효과적으로 대응하고, 변형 전후에 불량(예를 들면, 변형 자국의 관찰 등)이 발생하지 않으며, 재단성과 작업성이 우수하고, 들뜸, 박리 및/또는 기포 발생 등도 유발되지 않으며, 편광판을 생략할 수 있는 수준의 투과율을 나타내는 점착제층을 형성하는 점착제 조성물을 제공할 수 있다.