EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof
The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufact...
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| creator | KIM HO GYUN YOON JONG HWA KIM YOUNG JUE PARK JONG GIL KANG YOUN BONG CHUN, SUNG WOOK |
| description | The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufacturing method thereof. The high-frequency EMI shielding material of the present invention comprises: (a) a conductive adhesive layer; (b) a metal-plated fiber layer which is stacked on the conductive adhesive layer; and (c) an insulating layer which is stacked on the metal-plated fiber layer.
본 발명은 기존의 도금박을 이용한 차폐 소재와는 달리 섬유에 금속을 도금하여 차폐 소재를 제작하는 것으로, 유연성 및 내열성이 뛰어난 고굴곡 특성을 가지는 고주파 EMI 차폐 소재 및 그 제조방법에 관한 것이다. 본 발명은 (a) 전도성 접착제층; (b) 상기 전도성 접착제층 상에 적층되는 금속도금 섬유층; 및 (c) 상기 금속도금 섬유층 상에 적층되는 절연층을 포함하는 고주파 EMI 차폐 소재를 제공한다. |
| format | Patent |
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본 발명은 기존의 도금박을 이용한 차폐 소재와는 달리 섬유에 금속을 도금하여 차폐 소재를 제작하는 것으로, 유연성 및 내열성이 뛰어난 고굴곡 특성을 가지는 고주파 EMI 차폐 소재 및 그 제조방법에 관한 것이다. 본 발명은 (a) 전도성 접착제층; (b) 상기 전도성 접착제층 상에 적층되는 금속도금 섬유층; 및 (c) 상기 금속도금 섬유층 상에 적층되는 절연층을 포함하는 고주파 EMI 차폐 소재를 제공한다.</description><language>eng ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221019&DB=EPODOC&CC=KR&NR=20220141084A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221019&DB=EPODOC&CC=KR&NR=20220141084A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM HO GYUN</creatorcontrib><creatorcontrib>YOON JONG HWA</creatorcontrib><creatorcontrib>KIM YOUNG JUE</creatorcontrib><creatorcontrib>PARK JONG GIL</creatorcontrib><creatorcontrib>KANG YOUN BONG</creatorcontrib><creatorcontrib>CHUN, SUNG WOOK</creatorcontrib><title>EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof</title><description>The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufacturing method thereof. The high-frequency EMI shielding material of the present invention comprises: (a) a conductive adhesive layer; (b) a metal-plated fiber layer which is stacked on the conductive adhesive layer; and (c) an insulating layer which is stacked on the metal-plated fiber layer.
본 발명은 기존의 도금박을 이용한 차폐 소재와는 달리 섬유에 금속을 도금하여 차폐 소재를 제작하는 것으로, 유연성 및 내열성이 뛰어난 고굴곡 특성을 가지는 고주파 EMI 차폐 소재 및 그 제조방법에 관한 것이다. 본 발명은 (a) 전도성 접착제층; (b) 상기 전도성 접착제층 상에 적층되는 금속도금 섬유층; 및 (c) 상기 금속도금 섬유층 상에 적층되는 절연층을 포함하는 고주파 EMI 차폐 소재를 제공한다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh09fVU8MhMz9BNK0otLE3NS65UAAkVZ2Sm5qRk5qUr5CaWpBZlJuYolGeWZChkAJUqpOWkVmQmZeZkllQqJOalAJXklaYlJpeUFoE0lGSkFqXmp_EwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDIyMDQxNDAwsTR2PiVAEAbYE7HA</recordid><startdate>20221019</startdate><enddate>20221019</enddate><creator>KIM HO GYUN</creator><creator>YOON JONG HWA</creator><creator>KIM YOUNG JUE</creator><creator>PARK JONG GIL</creator><creator>KANG YOUN BONG</creator><creator>CHUN, SUNG WOOK</creator><scope>EVB</scope></search><sort><creationdate>20221019</creationdate><title>EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof</title><author>KIM HO GYUN ; YOON JONG HWA ; KIM YOUNG JUE ; PARK JONG GIL ; KANG YOUN BONG ; CHUN, SUNG WOOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220141084A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM HO GYUN</creatorcontrib><creatorcontrib>YOON JONG HWA</creatorcontrib><creatorcontrib>KIM YOUNG JUE</creatorcontrib><creatorcontrib>PARK JONG GIL</creatorcontrib><creatorcontrib>KANG YOUN BONG</creatorcontrib><creatorcontrib>CHUN, SUNG WOOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM HO GYUN</au><au>YOON JONG HWA</au><au>KIM YOUNG JUE</au><au>PARK JONG GIL</au><au>KANG YOUN BONG</au><au>CHUN, SUNG WOOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof</title><date>2022-10-19</date><risdate>2022</risdate><abstract>The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufacturing method thereof. The high-frequency EMI shielding material of the present invention comprises: (a) a conductive adhesive layer; (b) a metal-plated fiber layer which is stacked on the conductive adhesive layer; and (c) an insulating layer which is stacked on the metal-plated fiber layer.
본 발명은 기존의 도금박을 이용한 차폐 소재와는 달리 섬유에 금속을 도금하여 차폐 소재를 제작하는 것으로, 유연성 및 내열성이 뛰어난 고굴곡 특성을 가지는 고주파 EMI 차폐 소재 및 그 제조방법에 관한 것이다. 본 발명은 (a) 전도성 접착제층; (b) 상기 전도성 접착제층 상에 적층되는 금속도금 섬유층; 및 (c) 상기 금속도금 섬유층 상에 적층되는 절연층을 포함하는 고주파 EMI 차폐 소재를 제공한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof |
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