EMI High-frequency EMI shielding material with high flexibility and manufacturing thereof

The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufact...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM HO GYUN, YOON JONG HWA, KIM YOUNG JUE, PARK JONG GIL, KANG YOUN BONG, CHUN, SUNG WOOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention is to manufacture a shielding material by plating metal on fiber, unlike conventional shielding materials using plating foil, and relates to a high-frequency EMI shielding material having excellent flexibility and heat resistance and high bending characteristics, and a manufacturing method thereof. The high-frequency EMI shielding material of the present invention comprises: (a) a conductive adhesive layer; (b) a metal-plated fiber layer which is stacked on the conductive adhesive layer; and (c) an insulating layer which is stacked on the metal-plated fiber layer. 본 발명은 기존의 도금박을 이용한 차폐 소재와는 달리 섬유에 금속을 도금하여 차폐 소재를 제작하는 것으로, 유연성 및 내열성이 뛰어난 고굴곡 특성을 가지는 고주파 EMI 차폐 소재 및 그 제조방법에 관한 것이다. 본 발명은 (a) 전도성 접착제층; (b) 상기 전도성 접착제층 상에 적층되는 금속도금 섬유층; 및 (c) 상기 금속도금 섬유층 상에 적층되는 절연층을 포함하는 고주파 EMI 차폐 소재를 제공한다.