Polyimide precursor composition and method for producing polyimide film using the same

A polyimide precursor composition that can be used in the manufacture of flexible substrates; a method for manufacturing a polyimide film using the same and a display device including the polyimide film are disclosed. The polyimide precursor composition may include a mixed solvent including 3-methox...

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Hauptverfasser: BAE MIN YOUNG, JUNG JAE HOON, AN MIN SHI, KIM DONG MIN, CHO YOUNG WOON, CHA YOUNG CHUL, PARK SE JOO
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:A polyimide precursor composition that can be used in the manufacture of flexible substrates; a method for manufacturing a polyimide film using the same and a display device including the polyimide film are disclosed. The polyimide precursor composition may include a mixed solvent including 3-methoxy-N,N-dimethylpropionamide (M3DMPA) and N,N-dimethylpropionamide (DMPA); and polyamic acid or polyimide. 플렉서블 기판의 제조에 사용될 수 있는 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 필름 제조방법 및 폴리이미드 필름을 포함하는 디스플레이 소자가 개시된다. 상기 폴리이미드 전구체 조성물은 3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)를 포함하는 혼합 용매; 및 폴리아믹산 또는 폴리이미드;를 포함한다.