PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

The present disclosure is to provide a printed circuit board advantageous in reducing overall thickness and product miniaturization, and an electronic component package including the same. The printed circuit board according to the present disclosure includes: a first insulating layer; a first cavit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SANG HOON, HWANG CHI WON, HONG SUK CHANG, KIM GYU MOOK, KO YOUNG KUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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