PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

The present disclosure is to provide a printed circuit board advantageous in reducing overall thickness and product miniaturization, and an electronic component package including the same. The printed circuit board according to the present disclosure includes: a first insulating layer; a first cavit...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM SANG HOON, HWANG CHI WON, HONG SUK CHANG, KIM GYU MOOK, KO YOUNG KUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure is to provide a printed circuit board advantageous in reducing overall thickness and product miniaturization, and an electronic component package including the same. The printed circuit board according to the present disclosure includes: a first insulating layer; a first cavity which is formed on one surface of the first insulating layer; a plurality of protrusion parts which are disposed in the first cavity to be spaced apart from each other; and a first wiring layer which is embedded in one surface of the first insulating layer. 본 개시는 제1 절연층; 상기 제1 절연층의 일면에 형성된 제1 캐비티; 상기 제1 캐비티 내에 서로 이격되어 배치된 복수의 돌출부; 및 상기 제1 절연층의 일면에 매립된 제1 배선층; 을 포함하는, 인쇄회로기판에 관한 것이다.