SURFACE TREATMENT COMPOSITION SURFACE TREATMENT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

A means capable of sufficiently removing residues remaining on the surface of a polished object to be polished is provided. Provided is the surface treatment composition, as a surface treatment composition used to reduce residue on the surface of a polished object to be polished contains a solvent a...

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Bibliographische Detailangaben
Hauptverfasser: YOSHINO TSUTOMU, IZAWA YOSHIHIRO, ISHIDA YASUTO
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:A means capable of sufficiently removing residues remaining on the surface of a polished object to be polished is provided. Provided is the surface treatment composition, as a surface treatment composition used to reduce residue on the surface of a polished object to be polished contains a solvent and a water-soluble polymer, wherein the adsorption amount of the water-soluble polymer to a crystal oscillator microbalance electrode is 100 ng/cm^2 or more and 600 ng/cm^2 or less per unit area of the crystal oscillator microbalance electrode. 연마 완료 연마 대상물의 표면에 잔류하는 잔사를 충분히 제거할 수 있는 수단을 제공한다. 연마 완료 연마 대상물의 표면에 있어서의 잔사를 저감하기 위해 사용되는 표면 처리 조성물로서, 용매와, 수용성 고분자를 함유하고, 수정 진동자 마이크로 밸런스 전극에 대한 상기 수용성 고분자의 흡착량이, 상기 수정 진동자 마이크로 밸런스 전극의 단위 면적당 100ng/㎠ 이상 600ng/㎠ 이하인 표면 처리 조성물이 제공된다.