SIP SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTEGRATED SIP MODULE WITH EMBEDDED INDUCTOR OR PACKAGE

A semiconductor device has a substrate on which a first opening part and a second opening part are formed. A first semiconductor component is disposed on the substrate. The substrate is placed on a carrier. A second semiconductor component is disposed on the carrier in the first opening part of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BEAK WOONJAE, YANG DEOKKYUNG, LEE HEESOO, PARK YISU, KIM OHHAN, LEE HUNTEAK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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