Method for forming metal pattern selectively using water soluble polymer

The present invention relates to a method for forming a metal pattern selectively using a water-soluble polymer. One embodiment of the present invention comprises: forming a water-soluble polymer layer (20) by applying a water-soluble polymer material on the substrate (10) (S100); forming an etching...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK JAE YOUNG, LEE HO NYUN, KIM HO HYEONG, LEE MIN SU, LEE HEUNG YEOL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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