SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic compone...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAM HO HYUNG, JANG JUN HYEONG, MIN TAE HONG, HYUNG GUN HWI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!