SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic compone...

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Bibliographische Detailangaben
Hauptverfasser: HAM HO HYUNG, JANG JUN HYEONG, MIN TAE HONG, HYUNG GUN HWI
Format: Patent
Sprache:eng ; kor
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic component which is disposed in the second cavity. The heat dissipation member includes a carbon fabric reinforced polymer (CFRP). 본 개시는 코어층; 상기 코어층에 형성된 제1 캐비티; 상기 제1 캐비티에 배치되며, 제2 캐비티가 형성된 방열부재; 및 상기 제2 캐비티에 배치되는 전자부품; 을 포함하며, 상기 방열부재는, CFRP(Carbon Fabric Reinfoeced Polymer)를 포함하는, 전자부품 내장기판에 관한 것이다.