SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic compone...

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Hauptverfasser:	HAM HO HYUNG, JANG JUN HYEONG, MIN TAE HONG, HYUNG GUN HWI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	HAM HO HYUNG JANG JUN HYEONG MIN TAE HONG HYUNG GUN HWI
description	The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic component which is disposed in the second cavity. The heat dissipation member includes a carbon fabric reinforced polymer (CFRP). 본 개시는 코어층; 상기 코어층에 형성된 제1 캐비티; 상기 제1 캐비티에 배치되며, 제2 캐비티가 형성된 방열부재; 및 상기 제2 캐비티에 배치되는 전자부품; 을 포함하며, 상기 방열부재는, CFRP(Carbon Fabric Reinfoeced Polymer)를 포함하는, 전자부품 내장기판에 관한 것이다.
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The heat dissipation member includes a carbon fabric reinforced polymer (CFRP). 본 개시는 코어층; 상기 코어층에 형성된 제1 캐비티; 상기 제1 캐비티에 배치되며, 제2 캐비티가 형성된 방열부재; 및 상기 제2 캐비티에 배치되는 전자부품; 을 포함하며, 상기 방열부재는, CFRP(Carbon Fabric Reinfoeced Polymer)를 포함하는, 전자부품 내장기판에 관한 것이다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=KR&NR=20220130916A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=KR&NR=20220130916A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAM HO HYUNG</creatorcontrib><creatorcontrib>JANG JUN HYEONG</creatorcontrib><creatorcontrib>MIN TAE HONG</creatorcontrib><creatorcontrib>HYUNG GUN HWI</creatorcontrib><title>SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN</title><description>The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic component which is disposed in the second cavity. The heat dissipation member includes a carbon fabric reinforced polymer (CFRP). 본 개시는 코어층; 상기 코어층에 형성된 제1 캐비티; 상기 제1 캐비티에 배치되며, 제2 캐비티가 형성된 방열부재; 및 상기 제2 캐비티에 배치되는 전자부품; 을 포함하며, 상기 방열부재는, CFRP(Carbon Fabric Reinfoeced Polymer)를 포함하는, 전자부품 내장기판에 관한 것이다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJDnUKDglyDHFVCPcM8VBw9XF1Dgny9_N0VnD29w3w93P1C1Fw9XVydXFxdVEI8XANcvX042FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGRgaGxgaWhmaOxsSpAgB5XyhY</recordid><startdate>20220927</startdate><enddate>20220927</enddate><creator>HAM HO HYUNG</creator><creator>JANG JUN HYEONG</creator><creator>MIN TAE HONG</creator><creator>HYUNG GUN HWI</creator><scope>EVB</scope></search><sort><creationdate>20220927</creationdate><title>SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN</title><author>HAM HO HYUNG ; JANG JUN HYEONG ; MIN TAE HONG ; HYUNG GUN HWI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220130916A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HAM HO HYUNG</creatorcontrib><creatorcontrib>JANG JUN HYEONG</creatorcontrib><creatorcontrib>MIN TAE HONG</creatorcontrib><creatorcontrib>HYUNG GUN HWI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAM HO HYUNG</au><au>JANG JUN HYEONG</au><au>MIN TAE HONG</au><au>HYUNG GUN HWI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN</title><date>2022-09-27</date><risdate>2022</risdate><abstract>The present disclosure relates to a substrate with an electronic component embedded therein, which comprises: a core layer; a first cavity which is formed in the core layer; a heat dissipation member which is disposed in the first cavity, and is formed with a second cavity; and an electronic component which is disposed in the second cavity. The heat dissipation member includes a carbon fabric reinforced polymer (CFRP). 본 개시는 코어층; 상기 코어층에 형성된 제1 캐비티; 상기 제1 캐비티에 배치되며, 제2 캐비티가 형성된 방열부재; 및 상기 제2 캐비티에 배치되는 전자부품; 을 포함하며, 상기 방열부재는, CFRP(Carbon Fabric Reinfoeced Polymer)를 포함하는, 전자부품 내장기판에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
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