ELECTRONIC DEVICE INCLUDING HOUSING AND MANUFACTURING METHOD THEREOF

In various embodiments of the present document, disclosed are an electronic device including a dual-textured housing and a manufacturing method thereof. According to various embodiments disclosed in the present document, the electronic device includes: a housing which includes a first surface having...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE JINHO, HWANG YONGWOOK, PARK SUNGJIN, JANG YOUNGSOO, KIM SUNGHOON, CHOI SANGGYOU, CHOI BYOUNGHEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TELEPHONIC COMMUNICATION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	In various embodiments of the present document, disclosed are an electronic device including a dual-textured housing and a manufacturing method thereof. According to various embodiments disclosed in the present document, the electronic device includes: a housing which includes a first surface having a first surface roughness, a second surface having a second surface roughness different from that of the first surface, and a first connection part between the first surface and the second surface; and an oxide film layer which is formed on the first surface, the second surface, and the first connection part, to have substantially the same thickness thereon. In addition, various embodiments can be applied. 본 문서의 다양한 실시예들에서는, 이중 질감을 가지는 하우징을 포함하는 전자 장치 및 그에 대한 제조 방법을 개시한다. 본 문서에 개시된 다양한 실시예들에 따르면, 제 1 표면 조도를 가지는 제 1 면; 및 상기 제 1 면과 다른 제 2 표면 조도를 가지는 제 2 면을 포함하고, 상기 제 1 면과 상기 제 2 면 사이의 제 1 연결부분을 포함하는 하우징; 및 상기 제 1 면, 상기 제 2 면 및 상기 제 1 연결부분 상에 실질적으로 동일한 두께를 가지도록 형성된 산화 피막층을 포함하는 전자 장치를 제공할 수 있다. 이 밖에 다양한 실시예들이 적용될 수 있다.