Apparatus for removing film on wafer
A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part in...
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| creator | GIMM DAE HEE YOON YONGHYUK OH JONGSEOB |
| description | A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part injecting a gas for removing the particles into the process chamber through the at least one injection hole; and a laser supply part for emitting a laser to a selected portion of the wafer through the at least one injection hole.
본 발명의 웨이퍼 막질 제거 장치는 막 제거 공정이 진행될 웨이퍼가 안착된 척을 구비하는 공정 챔버; 상기 공정 챔버의 상기 웨이퍼에 대응하는 상측 부분에 배치되는 적어도 하나의 주입구; 상기 적어도 하나의 주입구를 통해 상기 파티클을 제거하기 위한 가스를 상기 공정 챔버로 주입하는 가스 공급부; 및 상기 적어도 하나의 주입구를 통해 상기 웨이퍼의 선택된 부분으로 레이저를 조사하기 위한 레이저 공급부를 포함할 수 있다. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20220128729A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20220128729A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20220128729A3</originalsourceid><addsrcrecordid>eNrjZFBxLChILEosKS1WSMsvUihKzc0vy8xLV0jLzMlVyM9TKE9MSy3iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkZGBoZGFuZGlo7GxKkCAJ1HJ4Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Apparatus for removing film on wafer</title><source>esp@cenet</source><creator>GIMM DAE HEE ; YOON YONGHYUK ; OH JONGSEOB</creator><creatorcontrib>GIMM DAE HEE ; YOON YONGHYUK ; OH JONGSEOB</creatorcontrib><description>A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part injecting a gas for removing the particles into the process chamber through the at least one injection hole; and a laser supply part for emitting a laser to a selected portion of the wafer through the at least one injection hole.
본 발명의 웨이퍼 막질 제거 장치는 막 제거 공정이 진행될 웨이퍼가 안착된 척을 구비하는 공정 챔버; 상기 공정 챔버의 상기 웨이퍼에 대응하는 상측 부분에 배치되는 적어도 하나의 주입구; 상기 적어도 하나의 주입구를 통해 상기 파티클을 제거하기 위한 가스를 상기 공정 챔버로 주입하는 가스 공급부; 및 상기 적어도 하나의 주입구를 통해 상기 웨이퍼의 선택된 부분으로 레이저를 조사하기 위한 레이저 공급부를 포함할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220922&DB=EPODOC&CC=KR&NR=20220128729A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220922&DB=EPODOC&CC=KR&NR=20220128729A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GIMM DAE HEE</creatorcontrib><creatorcontrib>YOON YONGHYUK</creatorcontrib><creatorcontrib>OH JONGSEOB</creatorcontrib><title>Apparatus for removing film on wafer</title><description>A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part injecting a gas for removing the particles into the process chamber through the at least one injection hole; and a laser supply part for emitting a laser to a selected portion of the wafer through the at least one injection hole.
본 발명의 웨이퍼 막질 제거 장치는 막 제거 공정이 진행될 웨이퍼가 안착된 척을 구비하는 공정 챔버; 상기 공정 챔버의 상기 웨이퍼에 대응하는 상측 부분에 배치되는 적어도 하나의 주입구; 상기 적어도 하나의 주입구를 통해 상기 파티클을 제거하기 위한 가스를 상기 공정 챔버로 주입하는 가스 공급부; 및 상기 적어도 하나의 주입구를 통해 상기 웨이퍼의 선택된 부분으로 레이저를 조사하기 위한 레이저 공급부를 포함할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBxLChILEosKS1WSMsvUihKzc0vy8xLV0jLzMlVyM9TKE9MSy3iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBkZGBoZGFuZGlo7GxKkCAJ1HJ4Y</recordid><startdate>20220922</startdate><enddate>20220922</enddate><creator>GIMM DAE HEE</creator><creator>YOON YONGHYUK</creator><creator>OH JONGSEOB</creator><scope>EVB</scope></search><sort><creationdate>20220922</creationdate><title>Apparatus for removing film on wafer</title><author>GIMM DAE HEE ; YOON YONGHYUK ; OH JONGSEOB</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220128729A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>GIMM DAE HEE</creatorcontrib><creatorcontrib>YOON YONGHYUK</creatorcontrib><creatorcontrib>OH JONGSEOB</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GIMM DAE HEE</au><au>YOON YONGHYUK</au><au>OH JONGSEOB</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatus for removing film on wafer</title><date>2022-09-22</date><risdate>2022</risdate><abstract>A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part injecting a gas for removing the particles into the process chamber through the at least one injection hole; and a laser supply part for emitting a laser to a selected portion of the wafer through the at least one injection hole.
본 발명의 웨이퍼 막질 제거 장치는 막 제거 공정이 진행될 웨이퍼가 안착된 척을 구비하는 공정 챔버; 상기 공정 챔버의 상기 웨이퍼에 대응하는 상측 부분에 배치되는 적어도 하나의 주입구; 상기 적어도 하나의 주입구를 통해 상기 파티클을 제거하기 위한 가스를 상기 공정 챔버로 주입하는 가스 공급부; 및 상기 적어도 하나의 주입구를 통해 상기 웨이퍼의 선택된 부분으로 레이저를 조사하기 위한 레이저 공급부를 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Apparatus for removing film on wafer |
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