Apparatus for removing film on wafer

A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part in...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GIMM DAE HEE, YOON YONGHYUK, OH JONGSEOB
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A wafer film removal apparatus of the present invention may include: a process chamber having a chuck in which a wafer to be subjected to a film removal process is seated; at least one injection hole disposed in an upper portion of the process chamber corresponding to the wafer; a gas supply part injecting a gas for removing the particles into the process chamber through the at least one injection hole; and a laser supply part for emitting a laser to a selected portion of the wafer through the at least one injection hole. 본 발명의 웨이퍼 막질 제거 장치는 막 제거 공정이 진행될 웨이퍼가 안착된 척을 구비하는 공정 챔버; 상기 공정 챔버의 상기 웨이퍼에 대응하는 상측 부분에 배치되는 적어도 하나의 주입구; 상기 적어도 하나의 주입구를 통해 상기 파티클을 제거하기 위한 가스를 상기 공정 챔버로 주입하는 가스 공급부; 및 상기 적어도 하나의 주입구를 통해 상기 웨이퍼의 선택된 부분으로 레이저를 조사하기 위한 레이저 공급부를 포함할 수 있다.