method of fabricating and analyzing of specimen structure for scanning spreading resistance microscopy

Provided is a method for manufacturing and analyzing a sample structure of a scanning type spreading resistance microscope. The method for manufacturing and analyzing a sample structure comprises: a step of preparing a preliminary sample having an analysis target area; a step of cutting the prelimin...

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Bibliographische Detailangaben
Hauptverfasser:	KIMEUN, KIM YOUNG JE, LEE HAE JUNG, LEE SOO JEONG, YOO MI DUK, JEONG ROK HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBEMICROSCOPY [SPM] INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MEASURING NANOTECHNOLOGY PERFORMING OPERATIONS PHYSICS SCANNING-PROBE TECHNIQUES OR APPARATUS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a method for manufacturing and analyzing a sample structure of a scanning type spreading resistance microscope. The method for manufacturing and analyzing a sample structure comprises: a step of preparing a preliminary sample having an analysis target area; a step of cutting the preliminary sample to separate the preliminary sample into a first sample having a first analysis target area and a second sample having a second analysis target area; a step of manufacturing the sample structure by bonding the first sample and the second sample to enable the first analysis target area and the second analysis target area to be adjacent to each other; and a step of measuring resistance values with respect to the first analysis target area and the second analysis target area of the sample structure by using a conductive tip. 주사형 확산 저항 현미경의 시편 구조체 제조 방법 및 분석 방법이 제공된다. 상기 시편 구조체의 제조 방법 및 분석 방법은, 분석 대상 영역을 갖는 예비 시편을 준비하는 단계, 상기 예비 시편을 절단하여 상기 예비 시편을 제1 분석 대상 영역을 갖는 제1 시편 및 제2 분석 대상 영역을 갖는 제2 시편으로 분리시키는 단계, 상기 제1 분석 대상 영역 및 상기 제2 분석 대상 영역이 인접하도록 상기 제1 시편 및 상기 제2 시편을 접착시켜 상기 시편 구조체를 제조하는 단계, 및 전도성 팁을 이용하여 상기 시편 구조체의 상기 제1 분석 대상 영역 및 상기 제2 분석 대상 영역에 대해서 저항 값을 측정하는 단계를 포함할 수 있다.