INSULATING LAYER FOR MULTILAYERED PRINTED CIRCUIT BOARD

The present invention provides an insulation layer for a multi-layer printed circuit board capable of easily forming fine patterns and having excellent mechanical properties. The insulation layer for the multi-layer printed circuit board contains a thermosetting binder containing an alkali soluble r...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JEONG WOO JAE, AHN JEONG HYUK, MUN JEONG WOOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides an insulation layer for a multi-layer printed circuit board capable of easily forming fine patterns and having excellent mechanical properties. The insulation layer for the multi-layer printed circuit board contains a thermosetting binder containing an alkali soluble resin and a thermosetting resin. 본 발명은 미세패턴을 용이하게 형성할 수 있고 기계적 물성이 우수한 다층인쇄회로기판용 절연층을 제공한다.