Apparatus for grinding surface of substrate

According to one aspect of the present invention, provided is a substrate surface polishing device, comprising: a polishing device comprising a plurality of polishing rollers for polishing the surface of a substrate; and a substrate support member for supporting the substrate, wherein a rotational a...

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Bibliographische Detailangaben
Hauptverfasser:	KIM I GYUN, KU JONG HOE, KANG SUNG IL, KIM HONG CHAN, BAE IN SEOB, HEO JUNG HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	According to one aspect of the present invention, provided is a substrate surface polishing device, comprising: a polishing device comprising a plurality of polishing rollers for polishing the surface of a substrate; and a substrate support member for supporting the substrate, wherein a rotational axis of the polishing roller is disposed inclined with respect to a rotational axis of a neighboring polishing roller, thereby capable of stably polishing the surface of the substrate. 본 발명의 일 측면에 따르면, 기판의 표면을 연마하는 복수 개의 연마 롤러를 포함하는 연마 장치와, 상기 기판을 지지하는 기판 지지 부재를 포함하며, 상기 연마 롤러의 회전축은 이웃하는 연마 롤러의 회전축과 서로 경사지게 배치된 기판 표면 연마 장치를 제공한다.