POLYIMIDE RESIN AND POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPRISING THE SAME

In one embodiment of the present application, provided is a polyimide resin having at least one terminal to which a functional group represented by a chemical formula 1 or 2 is bonded. Since the polyimide resin according to an exemplary embodiment of the present application contains a functional gro...

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Bibliographische Detailangaben
Hauptverfasser:	SUNG JIYEON, LIM MINYOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	In one embodiment of the present application, provided is a polyimide resin having at least one terminal to which a functional group represented by a chemical formula 1 or 2 is bonded. Since the polyimide resin according to an exemplary embodiment of the present application contains a functional group with excellent adhesion to metal in the polyimide resin, it is possible to improve the adhesion strength to the metal. 본 출원의 일 실시상태는, 폴리이미드 수지의 적어도 하나의 말단에 화학식 1 또는 2로 표시되는 작용기가 결합된 것인 폴리이미드 수지를 제공한다.