블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름
본 발명에 관한 블록 공중합체는, 에틸렌성 불포화 단량체로부터 유래하는 구조 단위를 주체로 하고, 적어도 1이상의 메르캅토기를 갖는다. 또한, Mn이 5,000~500,000이고, 블록 구조가 A-B-A의 트리블록 구조, 또는 [A-B]qX의 별형 블록 구조이다. 단, q는 2 이상 6 이하의 정수이며, 중합체 블록(A)의 유리 전이 온도는 20℃이상이며, 상기 트리블록 구조의 경우의 중합체 블록(B)의 유리 전이 온도는 20℃미만이며, 상기 별형 블록 구조의 경우의 [중합체 블록(B)]qX의 유리 전이 온도가 20℃미만이다. 또한...
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| creator | MATSUDA YUKIE MIZUNO YUKI OBA KAZUTOSHI NAKAZATO ATSUSHI GOTO ATSUSHI |
| description | 본 발명에 관한 블록 공중합체는, 에틸렌성 불포화 단량체로부터 유래하는 구조 단위를 주체로 하고, 적어도 1이상의 메르캅토기를 갖는다. 또한, Mn이 5,000~500,000이고, 블록 구조가 A-B-A의 트리블록 구조, 또는 [A-B]qX의 별형 블록 구조이다. 단, q는 2 이상 6 이하의 정수이며, 중합체 블록(A)의 유리 전이 온도는 20℃이상이며, 상기 트리블록 구조의 경우의 중합체 블록(B)의 유리 전이 온도는 20℃미만이며, 상기 별형 블록 구조의 경우의 [중합체 블록(B)]qX의 유리 전이 온도가 20℃미만이다. 또한, X는 개시제 잔기 또는/및 커플링제 잔기, 또는 그의 유도체이다.
A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20220111300A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20220111300A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20220111300A3</originalsourceid><addsrcrecordid>eNrjZIh7vWPK64VzFV5t3vpmycS3U1e-2bRFR-FNx4w3yxsU3izc8KZl4-s1e4Ai3QvebJsK5Cm87m-BqFnQ8mbeBIXXU6a83jDlzdwtb7qWKLze0A8Un_Bmw0qFt1NbXi9r4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGRgaGhobGBgaOxsSpAgDI31YF</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름</title><source>esp@cenet</source><creator>MATSUDA YUKIE ; MIZUNO YUKI ; OBA KAZUTOSHI ; NAKAZATO ATSUSHI ; GOTO ATSUSHI</creator><creatorcontrib>MATSUDA YUKIE ; MIZUNO YUKI ; OBA KAZUTOSHI ; NAKAZATO ATSUSHI ; GOTO ATSUSHI</creatorcontrib><description>본 발명에 관한 블록 공중합체는, 에틸렌성 불포화 단량체로부터 유래하는 구조 단위를 주체로 하고, 적어도 1이상의 메르캅토기를 갖는다. 또한, Mn이 5,000~500,000이고, 블록 구조가 A-B-A의 트리블록 구조, 또는 [A-B]qX의 별형 블록 구조이다. 단, q는 2 이상 6 이하의 정수이며, 중합체 블록(A)의 유리 전이 온도는 20℃이상이며, 상기 트리블록 구조의 경우의 중합체 블록(B)의 유리 전이 온도는 20℃미만이며, 상기 별형 블록 구조의 경우의 [중합체 블록(B)]qX의 유리 전이 온도가 20℃미만이다. 또한, X는 개시제 잔기 또는/및 커플링제 잔기, 또는 그의 유도체이다.
A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220809&DB=EPODOC&CC=KR&NR=20220111300A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220809&DB=EPODOC&CC=KR&NR=20220111300A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUDA YUKIE</creatorcontrib><creatorcontrib>MIZUNO YUKI</creatorcontrib><creatorcontrib>OBA KAZUTOSHI</creatorcontrib><creatorcontrib>NAKAZATO ATSUSHI</creatorcontrib><creatorcontrib>GOTO ATSUSHI</creatorcontrib><title>블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름</title><description>본 발명에 관한 블록 공중합체는, 에틸렌성 불포화 단량체로부터 유래하는 구조 단위를 주체로 하고, 적어도 1이상의 메르캅토기를 갖는다. 또한, Mn이 5,000~500,000이고, 블록 구조가 A-B-A의 트리블록 구조, 또는 [A-B]qX의 별형 블록 구조이다. 단, q는 2 이상 6 이하의 정수이며, 중합체 블록(A)의 유리 전이 온도는 20℃이상이며, 상기 트리블록 구조의 경우의 중합체 블록(B)의 유리 전이 온도는 20℃미만이며, 상기 별형 블록 구조의 경우의 [중합체 블록(B)]qX의 유리 전이 온도가 20℃미만이다. 또한, X는 개시제 잔기 또는/및 커플링제 잔기, 또는 그의 유도체이다.
A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh7vWPK64VzFV5t3vpmycS3U1e-2bRFR-FNx4w3yxsU3izc8KZl4-s1e4Ai3QvebJsK5Cm87m-BqFnQ8mbeBIXXU6a83jDlzdwtb7qWKLze0A8Un_Bmw0qFt1NbXi9r4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGRgaGhobGBgaOxsSpAgDI31YF</recordid><startdate>20220809</startdate><enddate>20220809</enddate><creator>MATSUDA YUKIE</creator><creator>MIZUNO YUKI</creator><creator>OBA KAZUTOSHI</creator><creator>NAKAZATO ATSUSHI</creator><creator>GOTO ATSUSHI</creator><scope>EVB</scope></search><sort><creationdate>20220809</creationdate><title>블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름</title><author>MATSUDA YUKIE ; MIZUNO YUKI ; OBA KAZUTOSHI ; NAKAZATO ATSUSHI ; GOTO ATSUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220111300A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUDA YUKIE</creatorcontrib><creatorcontrib>MIZUNO YUKI</creatorcontrib><creatorcontrib>OBA KAZUTOSHI</creatorcontrib><creatorcontrib>NAKAZATO ATSUSHI</creatorcontrib><creatorcontrib>GOTO ATSUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUDA YUKIE</au><au>MIZUNO YUKI</au><au>OBA KAZUTOSHI</au><au>NAKAZATO ATSUSHI</au><au>GOTO ATSUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름</title><date>2022-08-09</date><risdate>2022</risdate><abstract>본 발명에 관한 블록 공중합체는, 에틸렌성 불포화 단량체로부터 유래하는 구조 단위를 주체로 하고, 적어도 1이상의 메르캅토기를 갖는다. 또한, Mn이 5,000~500,000이고, 블록 구조가 A-B-A의 트리블록 구조, 또는 [A-B]qX의 별형 블록 구조이다. 단, q는 2 이상 6 이하의 정수이며, 중합체 블록(A)의 유리 전이 온도는 20℃이상이며, 상기 트리블록 구조의 경우의 중합체 블록(B)의 유리 전이 온도는 20℃미만이며, 상기 별형 블록 구조의 경우의 [중합체 블록(B)]qX의 유리 전이 온도가 20℃미만이다. 또한, X는 개시제 잔기 또는/및 커플링제 잔기, 또는 그의 유도체이다.
A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS DYES ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | 블록 공중합체, 수지 조성물, 신축성 도체, 전자 디바이스 및 점착 필름 |
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