Metal layer polishing slurry composition

Disclosed are a metal film polishing slurry composition and a method for reducing a scratch generated during metal film polishing using the same capable of decreasing an increasing temperature when polishing a metal film by reducing frictional force; and reducing the scratch by improving thermal sta...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN JONG CHUL, PARK CHANG YONG, PARK MIN SUNG, PARK JONG DAI, LEE GOO HWA, KIM JAE HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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