Sputtering target with reinforced O-ring groove and method for manufacturing the same
According to one embodiment of the present invention, as a sputtering target configured with a target part and a backing plate part, provided is the sputtering target comprising: a first reinforcement part formed on an upper surface of the backing plate part to surround a surrounding of the target p...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | According to one embodiment of the present invention, as a sputtering target configured with a target part and a backing plate part, provided is the sputtering target comprising: a first reinforcement part formed on an upper surface of the backing plate part to surround a surrounding of the target part; and a groove for an O-ring formed to surround the surrounding of the target part within an area of the first reinforcement part, wherein the first reinforcement part is formed of a material having a higher mechanical strength than that of the backing plate part. Therefore, the present invention is capable of having a technical effect of increasing a rigidity of the sputtering target.
본 발명의 일 실시예에 따르면, 타겟부와 백킹 플레이트부로 구성된 스퍼터링 타겟으로서, 상기 백킹 플레이트부의 상면에 상기 타겟부 주위를 둘러싸도록 형성된 제1 보강부; 및 제1 보강부의 영역 내에서 상기 타겟부 주위를 둘러싸도록 형성된 오링용 그루브;를 포함하고, 제1 보강부는 상기 백킹 플레이트부보다 기계적 강도가 높은 재질로 형성된 것을 특징으로 하는 스퍼터링 타겟을 제공한다. |
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