Resin Composition Manufacturing Method of Cured Body and Cured Body

The purpose of the present invention is to provide: a resin composition comprising polyamic acid capable of stably forming a cured product comprising polyimide and having excellent film-forming properties; a preparation method of a cured product using the resin composition; and a cured product obtai...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIKIDA JIRO, SHIOTA DAI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide: a resin composition comprising polyamic acid capable of stably forming a cured product comprising polyimide and having excellent film-forming properties; a preparation method of a cured product using the resin composition; and a cured product obtained by curing the resin composition. In a resin composition comprising polyamic acid (A), at least one selected from a group consisting of a carbonyl oxy compound (B1) having a -CO-O- bond in a molecule and a basic nitrogen-containing compound (B2) not having a -CO-O- bond in a molecule is blended. 제막성이 우수하고 폴리이미드를 포함하는 경화물을 안정적으로 형성할 수 있는 폴리아믹산을 함유하는 수지 조성물과 상기 수지 조성물을 이용하는 경화물의 제조 방법과 상기 수지 조성물을 경화하여 이루어지는 경화물을 제공하는 것. 폴리아믹산(A)을 함유하는 수지 조성물에, 분자 내에 -CO-O- 결합을 가지는 카르보닐옥시 화합물(B1), 및 분자 내에 -CO-O- 결합을 가지지 않는 염기성 함질소 화합물(B2)로 이루어진 군으로부터 선택되는 1종 이상을 배합한다.