Bonding apparatus method for display panel

According to an embodiment of the present invention, a bonding apparatus for a display may include: a conductive film attachment unit attaching a conductive film to one surface of a display panel; a pressurizing unit including an alignment module which aligns an attachment location of an IC member f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YONGSEOK CHOI, HYOUNJOO LEE, SANGJONG PAEK, MUNSU LEE, JEHUN YU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, a bonding apparatus for a display may include: a conductive film attachment unit attaching a conductive film to one surface of a display panel; a pressurizing unit including an alignment module which aligns an attachment location of an IC member for attaching the IC member including a chip on film at least onto the conductive film; and a main bonding unit fixing the chip on film and the conductive film to the display panel. The alignment module may include: a material reception unit locating the IC member on the conductive film by receiving the IC member to be rotated toward the location of the conductive film; a vertical axis rotation unit rotating the material reception unit; a first horizontal movement unit horizontally the material reception unit in a first direction; and a second horizontal movement unit moving the material reception unit in a second direction orthogonal to the first direction. The present invention has an effect of reducing installation costs and shortening a production time. 본 발명의 실시예에 따른 디스플레이용 본딩 장치는, 디스플레이 패널의 일 면에 도전 필름을 부착하는 도전 필름 부착 유닛; 적어도 칩온필름을 포함하는 IC 소재를, 상기 도전 필름 상에 부착하기 위하여 IC 소재의 부착 위치를 정렬하는 얼라인 모듈을 포함하는 가압 유닛; 및 상기 칩온필름과 상기 도전 필름을 상기 디스플레이 패널에 고정하는 본압 유닛을 포함하고, 상기 얼라인 모듈은, 상기 IC 소재를 수취하고 도전 필름 위치로 회전시켜서, 상기 상기 IC 소재가 상기 도전 필름 상에 위치시키는 자재 수취부; 상기 자재 수취부를 회전시키는 수직축 회전부; 상기 자재 수취부를 제 1 방향으로 수평 이동시키는 제 1 수평 이동부; 상기 자재 수취부를 상기 제 1 방향과 직교하는 제 2 방향으로 이동시키는 제 2 수평 이동부를 포함할 수 있다.