ADDITIVE FOR ELECTROLYTIC PLATING SOLUTION AND HIGH CURRENT ELECTROLYTIC NICKEL-PLATING SOLUTION COMPRISING THE SAME

The present invention relates to an electroplating solution additive and an electroplating solution containing the electroplating solution additive, comprising a specific first brightening agent, a second brightening agent, a leveler, and a surfactant. An objective of the present invention is to pro...

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Bibliographische Detailangaben
Hauptverfasser: KIM DEA GEUN, KANG JIN SEOK, CHUNG BO MOOK, CHUN, SUNG WOOK
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to an electroplating solution additive and an electroplating solution containing the electroplating solution additive, comprising a specific first brightening agent, a second brightening agent, a leveler, and a surfactant. An objective of the present invention is to provide the electroplating solution additive that can be universally applied to electrical nickel plating solutions and form a uniform plating film while shortening a nickel plating time. 본 발명은, 특정의 제1 광택제, 제2 광택제, 레벨러 및 계면활성제를 포함하는 전기 도금 용액 첨가제 및 상기 전기 도금 용액 첨가제를 포함하는 전기 니켈 도금 용액에 관한 것이다.