Encapsulating composition and Organic electronic device comprising the same

A sealing material composition according to the present invention comprises: a radical curable compound having at least one radical curable functional group, wherein the radical curable compound includes a monofunctional alicyclic compound (X1) and the monofunctional alicyclic compound (X1) includes...

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Bibliographische Detailangaben
Hauptverfasser:	KIM JEONG GON, JE GAL KWAN, LIM IS EUL, KIM HA NEUL, LIM YOON BIN, LEE TAE SEOB
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY COMPOSITIONS BASED THEREON COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A sealing material composition according to the present invention comprises: a radical curable compound having at least one radical curable functional group, wherein the radical curable compound includes a monofunctional alicyclic compound (X1) and the monofunctional alicyclic compound (X1) includes a compound represented by chemical formula 1 and can realize a low dielectric constant. 본 발명에 따른 밀봉재 조성물은 적어도 하나 이상의 라디칼 경화성 관능기를 갖는 라디칼 경화성 화합물을 포함하고, 상기 라디칼 경화성 화합물은 단관능 지환족 화합물(X1)을 포함하며, 상기 단관능 지환족 화합물(X1)은 상기 화학식 1로 나타내는 화합물을 포함하여, 저유전율을 구현할 수 있다.