APPARATUS AND METHOD FOR TREATING SUBSTRATE

The present invention provides an apparatus for processing a substrate. In one embodiment, a substrate processing method includes: a substrate support unit for supporting a substrate; a liquid supply unit including an EBR nozzle supplying an edge bead removal liquid to remove the edge portion of the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BAEK HYE BIN, LEE JUNG HYUN, SON YOUNG JUN, KIM KYUNG HAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides an apparatus for processing a substrate. In one embodiment, a substrate processing method includes: a substrate support unit for supporting a substrate; a liquid supply unit including an EBR nozzle supplying an edge bead removal liquid to remove the edge portion of the substrate where a coated film supported by the substrate support unit is formed; and an edge exhaust unit provided to be positioned adjacent to the EBL nozzle and including a suction nozzle sucking the scattered edge bead removal liquid supplied to the substrate. 본 발명은 기판을 처리하는 장치를 제공한다. 일 실시 예에 있어서, 기판 처리 방법은, 기판을 지지하는 기판 지지 유닛과; 상기 기판 지지 유닛에 지지된 도포막이 형성된 기판의 에지부가 제거되도록 에지 비드 제거액을 공급하는 이비알 노즐을 포함하는 액 공급 유닛과; 상기 이비알 노즐에 인접하게 위치 가능하게 제공되며, 상기 기판에 공급되어 비산된 에지 비드 제거액을 흡입하는 흡입 노즐을 포함하는 에지 배기 유닛을 포함한다.