ETCHING COMPOSITION FOR THIN FILM CONTAINING SILVER METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING A DISPLAY DEVICE USING THE SAME

An etching composition of a silver-containing thin film comprises an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water. The inorganic acid compound is the etching compound containing the nitrate. One pur...

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Bibliographische Detailangaben
Hauptverfasser:	LEE DONG HUN, PARK JONG HEE, LEE SUCK JUN, LIM KYU HUN, KIM JIN HYUNG, KIM HYOUNG SIK, JANG DONG MIN, MIN KYUNG CHAN, KWON O BYOUNG, KIM YOUNG MIN, NAM GI YONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	An etching composition of a silver-containing thin film comprises an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water. The inorganic acid compound is the etching compound containing the nitrate. One purpose of the present invention is to provide the etching composition of a silver-containing thin film. 은 함유 박막의 식각 조성물은 무기산 화합물, 술폰산 화합물, 유기산 화합물, 질산염, 금속 산화제, 아미노산 화합물 및 물을 포함한다.