Circuit Board
A circuit board comprises: a base layer; an electrode layer which is formed on the base layer; a passivation layer which is formed on the electrode layer while opening a portion of the electrode layer; and a surface treatment layer which is formed on an opened surface of the electrode layer. The sur...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | A circuit board comprises: a base layer; an electrode layer which is formed on the base layer; a passivation layer which is formed on the electrode layer while opening a portion of the electrode layer; and a surface treatment layer which is formed on an opened surface of the electrode layer. The surface treatment layer includes 70 to 40 % of copper and 30 to 60 % of nickel.
회로 기판은 기재층, 기재층에 형성되는 전극층, 적극층의 일부를 개방하면서 전극층에 형성되는 패시베이션층, 그리고 전극층의 개방면에 형성되는 표면 처리층을 포함한다. 표면 처리층은 구리 70~40%와 니켈 30~60%을 포함할 수 있다. |
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