FEEDTHROUGH FOR ELECTRICALLY CONNECTING BETWEEN INTERNAL PART AND EXTERNAL PART OF PROCESSING REGION IN SUBSTRATE PROCESSING APPRATUS

An embodiment of the present invention provides a feedthrough for electrically connecting between an internal part and an outer part of a processing region while sealing the process region, and a substrate processing apparatus and a boding facility including the feedthrough. The feedthrough for elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE HO SUNG, OH GEUN SIK, KIM YOUNG BUM, LIM CHAE MOOK, LEE DONG JOON, PARK SU CHUL, JEONG KWANG HYEON, KIM MIN CHEOL, JUNG WOO JUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!