SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS USING THE SAME

According to one embodiment of the present invention, a substrate treatment device comprises: a belt, where a mounting area, where a substrate is mounted, is defined, transferring the substrate in a first direction; a polishing unit disposed above the belt and having a larger area than an area of th...

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Bibliographische Detailangaben
Hauptverfasser:	JEONG YOUNGHO, KANG SEUNGBAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	According to one embodiment of the present invention, a substrate treatment device comprises: a belt, where a mounting area, where a substrate is mounted, is defined, transferring the substrate in a first direction; a polishing unit disposed above the belt and having a larger area than an area of the mounting area; and a conditioner spaced from the belt in a second direction crossing the first direction. The opening, where an abrasive is provided, can be defined in the polishing unit. 본 발명의 일 실시예에 따른 기판 처리 장치는 기판이 안착되는 안착 영역이 정의되며, 상기 기판을 제1 방향으로 이송하는 벨트, 상기 벨트 위에 배치되며 상기 안착 영역의 면적보다 큰 면적을 갖는 연마부, 및 상기 벨트로부터 상기 제1 방향과 교차하는 제2 방향으로 이격된 컨디셔너를 포함하고, 상기 연마부에는 연마제가 제공되는 개구부가 정의될 수 있다.