코일 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

자성분과, 에폭시 수지와, 경화제와, 아릴기를 갖는 포스핀의 분자 내 염을 포함하는 경화 촉진제를 포함하는 코일 밀봉용 수지 조성물. This coil sealing resin composition contains: a magnetic powder; an epoxy resin; a curing agent; and a curing accelerator containing an intramolecular salt of a phosphine having an aryl group....

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Bibliographische Detailangaben
Hauptverfasser:	INABA YOSHIHITO, SHIBA SHIZUKA, YAMAGUCHI SHOHEI, KANG DONGCHUL
Format:	Patent
Sprache:	kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRICITY INDUCTANCES MAGNETS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSFORMERS USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	자성분과, 에폭시 수지와, 경화제와, 아릴기를 갖는 포스핀의 분자 내 염을 포함하는 경화 촉진제를 포함하는 코일 밀봉용 수지 조성물. This coil sealing resin composition contains: a magnetic powder; an epoxy resin; a curing agent; and a curing accelerator containing an intramolecular salt of a phosphine having an aryl group.