EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME

Provided are an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, an inorganic filler, and a curing catalyst, wherein the epoxy resin comprises the epoxy resin of chemical formula 1, and the semiconductor device sealed by using the same. The presen...

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Bibliographische Detailangaben
Hauptverfasser:	SEO MIN JOON, PARK YONG YEOP, BAE KYOUNG CHUL, LEE CHUL HO, LEE DONG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided are an epoxy resin composition for sealing a semiconductor device comprising an epoxy resin, a curing agent, an inorganic filler, and a curing catalyst, wherein the epoxy resin comprises the epoxy resin of chemical formula 1, and the semiconductor device sealed by using the same. The present invention provides the epoxy resin composition for encapsulating the semiconductor device having high thermal conductivity, significantly improved heat dissipation effect, and improved fluidity. 에폭시 수지, 경화제, 무기 충전제 및 경화 촉매를 포함하고, 상기 에폭시 수지는 화학식 1의 에폭시 수지를 포함하는 것인, 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자가 제공된다.