APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR CLEANING THE SUBSTRATE USIMG THE SMAE

Provided is a substrate processing device. In one embodiment, a substrate processing device comprises: a housing; a spin head disposed within the housing and supporting a substrate; a plurality of nozzle units provided under the spin head and spraying a cleaning liquid to a lower surface of the subs...

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Bibliographische Detailangaben
1. Verfasser:	NOH SANG EUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a substrate processing device. In one embodiment, a substrate processing device comprises: a housing; a spin head disposed within the housing and supporting a substrate; a plurality of nozzle units provided under the spin head and spraying a cleaning liquid to a lower surface of the substrate; and a controller for controlling the nozzle unit. The controller may control the nozzle unit to discharge the cleaning liquid in a second direction opposite to a first direction for a second time after the nozzle unit discharges the cleaning liquid in the first direction for a first time. 본 발명은 기판 처리 장치를 제공한다. 일 예에서, 기판 처리 장치는, 하우징; 하우징 내에 배치되고 기판을 지지하는 스핀 헤드와; 스핀 헤드의 하부에 제공되며 기판의 저면으로 세정액을 분사하는 복수 개의 노즐 유닛과; 노즐 유닛을 제어하는 제어기를 포함하되, 제어기는, 노즐 유닛이 제1방향으로 제1시간 동안 세정액을 토출한 이후에, 제1방향과 반대 방향인 제2방향으로 제2시간 동안 세정액을 토출하도록 노즐 유닛을 제어할 수 있다.