EPOXY ADHESIVE COMPOSITION HAVING EXCELLENT FLUIDITY AND DIE ATTACH FILM INCLUDING THE SAME

Disclosed in the present specification is an epoxy adhesive composition and a die attach film including the same. The epoxy adhesive composition includes a thermoplastic resin, an epoxy resin, an inorganic filler, and an epoxy hardener. According to the present invention, the epoxy adhesive composit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NHO SEUNG HOON, DOH SANG GIL, YOO KYUNG SEOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed in the present specification is an epoxy adhesive composition and a die attach film including the same. The epoxy adhesive composition includes a thermoplastic resin, an epoxy resin, an inorganic filler, and an epoxy hardener. According to the present invention, the epoxy adhesive composition satisfies processability such as sawing and picking-up, and reliability required for semiconductor packaging. 본 명세서에는 폭시 접착제 조성물 및 이를 포함하는 다이 어태치 필름이 개시된다.