열전도성 개량제, 열전도성 개량 방법, 열전도성 수지 조성물 및 열전도성 수지 성형체

우수한 열전도성을 갖는 수지 조성물을 제공한다. 열전도성 수지 조성물로서, 수지와, 애스펙트비가 10 이상이고, 장경(長徑)이 30 ㎛ 미만인 제1 열전도성 필러와, 애스펙트비가 2 이하인 제2 열전도성 필러를 포함한다. Provided is a resin composition having excellent thermal conductivity. The thermally conductive resin composition includes: a resin; a first thermally conductive filler having...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IWAMOTO YOSHIHITO, TAKAHASHI KATSUHIRO
Format:	Patent
Sprache:	kor
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	우수한 열전도성을 갖는 수지 조성물을 제공한다. 열전도성 수지 조성물로서, 수지와, 애스펙트비가 10 이상이고, 장경(長徑)이 30 ㎛ 미만인 제1 열전도성 필러와, 애스펙트비가 2 이하인 제2 열전도성 필러를 포함한다. Provided is a resin composition having excellent thermal conductivity. The thermally conductive resin composition includes: a resin; a first thermally conductive filler having an aspect ratio of 10 or more and a long diameter of less than 30 µm; and a second thermally conductive filler having an aspect ratio of 2 or less.